Polycom DOC2238A Instrukcja Użytkownika Pobierz pdf (Strona 46)

Chapter 2 - Hardware Installation

2-26

MGC+50 Hardware Installation

Unpacking and Positioning the MGC+50

To unpack and position the MGC+50:

1. When you receive your MGC+50, inspect the equipment for damage and

verify that the components match the packing slip. If you did not receive

a component or if there is damage to the system, notify Polycom

immediately.

Figure 2-12: MGC+50 package

2. Place the MGC+50 unit on a stable flat surface in a location that meets

the MGC+50’s environment requirements, which are:

— Operating temperature: 10°–40°C (50°–104°F)

— Humidity: 15%–90% noncondensing

— Altitude: Up to 3,000m (10,000ft)

— ESD: +8 kV

Carrying Strap

Lock in Open Position

Wood Packing Case

Lock in Closed Position

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Polycom DOC2238A Instrukcja Użytkownika Strona 46